新存科技（武汉）有限责任公司招聘光刻工艺研发工程师|工艺整合工程师

新存科技（武汉）有限责任公司

发布时间：2023-11-13 20:00:00

行政区划： 东西湖区	经济类型： -
单位性质： 其他企业	单位行业： 计算机、通信和其他电子设备制造业

1、 公司简介

1、基本信息:

新存科技（武汉）有限责任公司是一家专注于新型存储芯片研发、生产、销售的高科技企业。公司成立于2022年7月，目前员工约150人，其中80%以上为研发人员, 硕士及以上学历占比78%。

2、产品简介:

随着万物智联时代的到来，人工智能、大数据中心、智能汽车等新兴应用场景对存储提出了更高的性能要求，促使新型存储器迅速发展，影响未来存储器市场格局。新型存储器是SCM（存储类内存）的一种，可增加存储容量、降低成本，进而大幅提高存储系统整体性能。新型存储器被认为是非常有希望大规模量产的下一代非挥发性存储技术，近些年已经成为国际上关注的热点。该技术已作为独立存储介质广泛用于数据中心、服务器、人工智能等多个数字基础设施建设核心领域。

3、科研成果:

新型存储器技术研发已产生多项技术成果。基于该技术已申请发明专利合计273件，其中国际专利60件，中国专利213件；已获授权中国专利51件，已获授权集成电路布图设计11个。这些科研技术成果将助力大数据中心、人工智能、工业互联网等新基建及“东数西算”工程的高速建设。

4、经营目标:

公司将持续推进与我国头部云服务厂商的技术合作，在现有的我国首款新型存储器原型芯片的基础上，研发并产业化我国首款新型存储器产品芯片，并力争在2024年底实现小规模量产。未来新存科技将与客户及上游合作伙伴共同推广新型存储产业生态发展，助力我国新型存储领域蓬勃发展。

5、未来愿景：

争做先进存储技术及产业推动的引领者，企业级计算机客户的高价值服务商，产业集群推动者，创新生态营造者，存储产业供应链安全保障的贡献者。

2、 招聘需求 1、 光刻工艺研发工程师（LITHO）

岗位职责：

1. Carry out LITHO process development responsibility of new memory technologies such as PCM, FeRAM, MRAM and ReRAM in relevant process module

2. Develop and improve processes and recipes in relevant process module to meet structural, electrical and reliability requirement of new memory cell loop

3. Design and manage DOE experiments to analyze, extract, report and conclude to optimize critical processes and define follow-up actions

4.Interact with process integration, device, YE, YAE, and manufacturing to address process/technology gap and yield/margin issues

5. Deliver advanced process technology and define path to meet next generation product node requirement.

6. Evaluate routine offline, inline, WAT, SORT, reliability and backend data to support multi-functional failure analysis to understand defect root cause and failure mode to improve yield and reliability

7. Participate in wafer/lot and experiment management, handle fab excursion and ensure smooth project execution

8. Work with equipment vendor to develop new process and tool to meet technology development need

9. Evaluate new material, new tool and new functions to lower overall process cost

10. Review technical literature to gain in-depth understanding of project related topics and guide problem solving and development direction. Contribute to project IP.

任职要求：

1. MS or PhD in Electrical Engineering, Physics, Chemistry or other related technical field is required, or BS +3 years’ experience in engineering or related discipline 

2. Understanding semiconductor fabrication process, material, physics, device and concepts. 3+ years of Process Development and/or Process Integration desired 

3. Thorough understanding of physics, chemistry and engineering principles in relevant process module 

4. Proficient in data analysis, DOE and statistical techniques, Solid trouble shooting, experimental design and process control skills using in-line and offline data 

5. Strong communication, analysis, reporting/presentation and team building skills 

6. Self-motivated, self-governing with proven ability to work in multi-tasking and dynamic environment 

7. Prior experience in advanced semiconductor fab R&D or production and new memory technology development in relevant process module area is preferred.

2、 工艺整合工程师(PIE)

岗位职责：

1. Carry out process integration development responsibility of new memory technologies such as PCM, FeRAM, MRAM and ReRAM 

2. Evaluate routine offline, inline, WAT, SORT, reliability and backend data to solve problem and draw conclusion/decision 

3. Take ownership of process flow loop related to new memory cell development, and evaluate new process and integration scheme to meet memory cell spec 

4. Design and manage process and device experiments to analyze, extract, report and conclude to optimize critical processes and define follow-up actions 

5. Lead/Participate in test chip tapeout for new memory technology development and product chip tapeout for production introduction 

6. Interact with process module, material, simulation, device characterization and reliability group to optimize process flow, improve memory cell device performance and develop innovative solution to meet product requirement and qualification criteria 

7. Drive cross-functional team including process module, device, product engineering, design, YE, YAE, TO, and Test to address process/technology gap and yield/margin issues 

8. Review technical literature to gain in-depth understanding of project related topics and guide problem solving and development direction. Contribute to project IP pool 

9. Transfer RD technology to fab and support to realize successful mass production. 

10. Project management including resource allocation, WIP control and schedule planning etc.

任职要求：

1. MS or PhD in Electrical Engineering, Physics, Material or other related technical field is required, or BS +3 years experience in engineering or related discipline 

2. Familiar with semiconductor fabrication process, material, physics, device and concepts. 3+ years of Process Integration and/or Process Development desired 

3. Prior experience in advanced semiconductor fab R&D or production, and new memory technology development is desirable 

4. Expertise in process flow, process integration skill and inline/WAT/SORT/Backend data evaluation is a plus 

5. Good understanding of mainstream memory technologies such as DRAM, NAND, NOR and new memory technologies such as ReRAM, PCM, FeRAM is preferred

6.Proficient in data analysis, DOE and statistical techniques 

7. Capable of coordinating cross-functional tams to achieve project goal 

8. Strong communication, analysis, reporting/presentation and team building skills 

9. Self-motivated, self-governing with proven ability to work in multi-tasking & dynamic environment

3、 联系方式

联系人：胡女士

联系电话：18162348929

电子邮箱：belle_hu@partner.ymtc.com